Join us in San Francisco, CA, for OFC 2025 and visit our exhibit booth (#6049) during the conference to learn about how we assist businesses in propelling their inventive concepts into production-ready prototypes through our design enablement, multi-project wafer, and electronic-photonic test, assembly, and packaging services.
AIM Photonics Presents PICs, Heterogeneous Integration & Packaging for Next-Gen Integrated Photonics
Date: Wednesday, April 2
Time: 1:45-2:45 p.m. (PDT)
Location: Theater II, Moscone Convention Center
Our experts will provide insight into the future of silicon photonics and demonstrate how AIM Photonics technology offerings across the product development cycle enables prototype development from design through fabrication, assembly, and test.
Panelists
John Bowers
Director of the Institute for Energy Efficiency, University of California, Santa Barbara, United States
High Capacity Interconnects and Integrated Quantum Dot Lasers
David Harame
Chief Operating Officer, AIM Photonics, United States
PIC Prototype Development using AIM Photonics Multi-Project Wafer (MPW) and Test, Assembly, and Packaging Capabilities
Mike Zylstra
Director of Photonic Components, Analog Photonics, United States
Silicon Photonic Hybrid Lasers and Amplifiers Using Flip-Chip Integration